Momentum Circuits are pleased to offer a comprehensive range of standard and specialised laminate and substrate materials to suit your specific application requirements.

These materials include the following categories:

  • CEM1
  • CEM2
  • FR2
  • FR4 (standard to high Tg ratings)
  • PTFE (Rogers, Arlon and equivalent materials)
  • Ceramic materials
  • Aluminium substrates (Bo Yu, Ventec,Bergquist and nominated materials)
  • Bare Copper substrates
  • Flexible materials (polyimide)
  • Flexi-Rigid (polyimide and FR4 composites)

As our primary focus is to achieve the very best price and quality for our customers, we often advise to avoid requesting the use of a specific nominated material manufacturers such as Isola for example unless it is clearly specified as a requirement matched to approvals. The reason for this is they are relatively expensive European manufactured substrates compared to the often higher grade and much more cost effective local market materials used in volume China manufacture, and consequently will add unnecessary cost to your project.

Momentum offer a comprehensive range of FR4 substrates that span the full Tg spectrum as requested, and often our CAM engineering department will suggest elevated material specifications for use in complex or HDI applications to avoid inner layer issues during the thermal assembly process.

We provide various copper weight laminates to satisfy high current PCB applications and we specialise in the supply of aluminium substrates for use in LED lighting applications where the printed circuit board is an active heat dissipation device within the complete assembly design.

For flexible and flexi-rigid materials, we also offer comprehensive design rules and manufacturing guideline in order to achieve the very best results for your applications.


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Momentum Circuits are printed circuit board manufacturers with a team that has over 50 years of direct industry engineering experience in design, PCB manufacture and the total assembly process from prototype right through to volume assembly.